Products

Henkel provides different materials/solutions for electrical devices and applications for different usage and purpose.

Applications and usage

Item Photo Explanation
Potting materials Designed to protect electronic assemblies against environmental influences, improve mechanical strength and provide high electrical insulation for PCBs
Thermal management materials Interface materials between device and heat sink to enhance thermal conductivity
Encapsulants Offer excellent temperature stability, good thermal shock resistance, outstanding electrical insulation,  minimal shrinkage during cure, low stress and excellent chemical resistance for chip-on-board devices
Low pressure molding materials Benchmark for modern PCB and circuitry protection
Conformal coatings Cost-effective, process friendly materials for reliable circuit board protection

Descriptions

Thermal management materials

Bergquist products Explanation
Sil-Pad series Thermally Conductive Insulators
Bond-Ply and Liquid-Bond series Thermally Conductive Adhesive
Gap Filler series Thermally Conductive Liquid Gap Filling Materials
Gap Pad series Thermally Conductive Gap Filling Materials
Hi-Flow series Phase Change Interface Materials
TIC series Thermal Interface Compounds