
Products
Henkel provides different materials/solutions for electrical devices and applications for different usage and purpose.
Applications and usage
Item | Photo | Explanation |
Potting materials | ![]() ![]() ![]() |
Designed to protect electronic assemblies against environmental influences, improve mechanical strength and provide high electrical insulation for PCBs |
Thermal management materials | ![]() ![]() ![]() ![]() |
Interface materials between device and heat sink to enhance thermal conductivity |
Encapsulants | ![]() |
Offer excellent temperature stability, good thermal shock resistance, outstanding electrical insulation, minimal shrinkage during cure, low stress and excellent chemical resistance for chip-on-board devices |
Low pressure molding materials | ![]() ![]() |
Benchmark for modern PCB and circuitry protection |
Conformal coatings | ![]() ![]() ![]() |
Cost-effective, process friendly materials for reliable circuit board protection |
Descriptions
Thermal management materials
Bergquist products | Explanation |
Sil-Pad series | Thermally Conductive Insulators |
Bond-Ply and Liquid-Bond series | Thermally Conductive Adhesive |
Gap Filler series | Thermally Conductive Liquid Gap Filling Materials |
Gap Pad series | Thermally Conductive Gap Filling Materials |
Hi-Flow series | Phase Change Interface Materials |
TIC series | Thermal Interface Compounds |