Products
Henkel provides different materials/solutions for electrical devices and applications for different usage and purpose.
Applications and usage
| Item | Photo | Explanation |
| Potting materials | ![]() |
Designed to protect electronic assemblies against environmental influences, improve mechanical strength and provide high electrical insulation for PCBs |
| Thermal management materials | ![]() |
Interface materials between device and heat sink to enhance thermal conductivity |
| Encapsulants | ![]() |
Offer excellent temperature stability, good thermal shock resistance, outstanding electrical insulation, minimal shrinkage during cure, low stress and excellent chemical resistance for chip-on-board devices |
| Low pressure molding materials | ![]() |
Benchmark for modern PCB and circuitry protection |
| Conformal coatings | ![]() |
Cost-effective, process friendly materials for reliable circuit board protection |
Descriptions
Thermal management materials
| Bergquist products | Explanation |
| Sil-Pad series | Thermally Conductive Insulators |
| Bond-Ply and Liquid-Bond series | Thermally Conductive Adhesive |
| Gap Filler series | Thermally Conductive Liquid Gap Filling Materials |
| Gap Pad series | Thermally Conductive Gap Filling Materials |
| Hi-Flow series | Phase Change Interface Materials |
| TIC series | Thermal Interface Compounds |





